Platonized Wafers • PZT Wafers • Foundry • Process Elements

Platinized Silicon Wafers

Thin titanium/platinum films up to 4000 Å thick deposited on four- or six-inch silicon wafers. The platinum films can withstand up to 800°C in oxygen for one hour with no roughening or hillock formation.
Description • Specifications

PZT Wafers

Information coming soon

Process Elements

Processes Available to Researchers at Radiant

In today’s world, it is difficult to find sources for one time process step execution such as metal deposition, thermal annealing, and so on. If you are building devices and need access to certain processes available at Radiant, contact Gerald Salazar at 505-348-4322. Radiant will executed individual process steps for you for research quantities of samples. A general list of the processes available at Radiant appears below:

Thermal annealing

Spin coat and contact photolithography

Dicing

Metal deposition by e-beam evaporation

Fluorine plasma etch